3. A fine-grain aluminum wire (grain size is 0.2um) is thermocompressively bonded to aluminum thin film metallization (grain size about 2 um), as shown in the following diagram. What is the electromigration (accumulation or depletion) induced failure at the interface? Why? Divergence Al wire Al film Jem

3. A fine-grain aluminum wire (grain size is 0.2um) is thermocompressively bonded to aluminum thin film metallization (grain size about 2 um), as shown in the following diagram. What is the electromigration (accumulation or depletion) induced failure at the interface? Why? Divergence Al wire Al film Jem

Electricity for Refrigeration, Heating, and Air Conditioning (MindTap Course List)

10th Edition

ISBN:9781337399128

Author:Russell E. Smith

Publisher:Russell E. Smith

Chapter12: Electronic Control Devices

Section: Chapter Questions

Problem 14RQ

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