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3. An array of 10 silicon chips, each of length L = 10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T = 24°C and u.. 40 m/s. When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface. = 10 mm Isups to stay into 10 If the temperature of each chip may not exceed 80°C, what is the maximum allowable power per chip? What iq is the maximum allowable power if a turbulence promoter is used to trip the boundary layer at the lead- ing edge? (A turbulator is a device to make sure the flow becomes turbulent from the location of this turbulator.)

3. An array of 10 silicon chips, each of length L = 10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T = 24°C and u.. 40 m/s. When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface. = 10 mm Isups to stay into 10 If the temperature of each chip may not exceed 80°C, what is the maximum allowable power per chip? What iq is the maximum allowable power if a turbulence promoter is used to trip the boundary layer at the lead- ing edge? (A turbulator is a device to make sure the flow becomes turbulent from the location of this turbulator.)

Introduction to Chemical Engineering Thermodynamics
Introduction to Chemical Engineering Thermodynamics
8th Edition
ISBN:9781259696527
Author:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Publisher:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Chapter1: Introduction
Section: Chapter Questions
Problem 1.1P
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3. An array of 10 silicon chips, each of length L = 10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T = 24°C and u.. 40 m/s. When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface. = 10 mm Isups to stay into 10 If the temperature of each chip may not exceed 80°C, what is the maximum allowable power per chip? What iq is the maximum allowable power if a turbulence promoter is used to trip the boundary layer at the lead- ing edge? (A turbulator is a device to make sure the flow becomes turbulent from the location of this turbulator.)
Transcribed Image Text:3. An array of 10 silicon chips, each of length L = 10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T = 24°C and u.. 40 m/s. When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface. = 10 mm Isups to stay into 10 If the temperature of each chip may not exceed 80°C, what is the maximum allowable power per chip? What iq is the maximum allowable power if a turbulence promoter is used to trip the boundary layer at the lead- ing edge? (A turbulator is a device to make sure the flow becomes turbulent from the location of this turbulator.)
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